高精密印制电路板专用油墨生产商

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COANTS ELECTRONIC

PM-500 SN系列

新建文件夹-2-d62892ed4ab8049dc2a0a4bbb61105b

PM-500 SN11GM双组份液态感光防焊绿色油墨,适用于丝网印刷。

本产品耐化学性极佳,是应市场需求特别开发的化锡板专用高端油墨,同时兼顾良好的耐热性能,适应于各种表面处理制程,操作条件范围宽泛。

本产品符合欧盟RoHS和低卤要求。

PM-500 SN11GM is dual component type liquid photoimageable green Matt solder mask,Applicable for screen printing.

This product has excellent chemical resistance and is a special developed high-end ink for tin plate according to the market demand. At the same time, it has good heat resistance and is suitable for all kinds of surface treatment processes with a wide range of operating conditions.

Non-Halogen and accord with RoHS and Low halogen.

 

一、物性General properties

1

主剂Main agent

PM-500 SN11GM 

2

固化剂Hardener

 H-50 SNH6

3

颜色Color

绿色/Green

4

主剂粘度Main agent’s Viscosity (at 25℃)

240-280P

5

固化剂粘度Hardener’s Viscosity (at 25℃)

100-150P

6

混合比例Mixing ratio

主剂Main agent:固化剂Hardener=3:1

7

混合后粘度Viscosity after mixed (at 25℃)

160±20dPa.s

8

混合后固体含量Non-volatile % after mixed

78±3%

9

混合后比重Specific gravity after mixed

1.4±0.05

10

保存期限Shelf life

6个月/ 6 month after production

11

包装规格Package

1Kg/Cans(罐),10Kg/Box(箱)

 

二、应用操作指引

基板表面处理

 

化锡板推荐使用超粗化

化金板、塞孔板、塞连印板推荐使用超粗化、火山灰

OSP板、喷锡板使用超粗化、火山灰、喷砂或磨刷均可

 

 

开油

 

主剂与固化剂按比例混合,添加适量稀释剂,搅拌或震荡10分钟。

 

 

静置

 

20分钟以上,使油墨充分排出开油时产生的气泡,但不超过24小时。

 

 

印刷

 

第一面印刷焊接面,第二面印刷零件面;36T或者43T网印刷。

清洁筛网避开其他油墨污染,室温20-25℃,湿度小于60%RH

印刷厚度要求湿膜在38-45um,干燥后25-30um。

 

 

静置

 

20分钟以上,板材铜箔越厚,静置时间应越长,但不超过2个小时。

 

 

预烤

 

两面分别印刷、分别烘烤

第一面热风循环烤箱:温度70-75℃,时间10-20分钟

第二面热风循环烤箱:温度70-75℃,时间25-30分钟

两面同时印刷、同时烘烤

热风循环烤箱:温度70-75℃,时间35-55分钟

 

 

冷却

 

放置20分钟以上使板材充分冷却,但停放时间不超过24小时。

 

 

曝光

 

曝光能量一般在400-600mj/cm2 ,使用21级曝光尺保持感度在10-12格之间

 

 

静置

 

20分钟以上,但不超过24小时

 

 

显像

 

  压力2.0-2.5kg/cm2浓度1wt% Na2CO3,液温30±2℃,显像时间50-90秒

过显影缸后,再用1.5-2.0kg/cm2喷淋压力25℃左右的市水清洗60-100秒,使用2组以上海棉轮吸水,40℃以热风吹干

 

 

热固化

 

沉金板、沉锡板:150℃×50分钟;

抗氧化板、喷锡板:150℃×60分钟;

厚铜板(2OZ及以上)分段烤:第一段75℃×120分钟、第二段100℃×30分钟、第三段150℃×60分钟

两机作业塞孔板:第一段65℃×60分钟、第二段80℃×30分钟、第三段100℃×30分钟、第120℃×30分钟、第150℃×60分钟

 

 

丝印字符

 

丝网印刷设备及固化条件依字符油墨操作条件

 

 

 

 

Processing instructions

Pre-treatment

 

IMT recommended use superbond

ENIG, Plug Hole or recommended use superbond Pumice

OSP,HASL  can be superbond, pozzolana, sand blast or polish-brush

 

 

Mixing

 

Main agent and hardener are mixed in proportion, add appropriate thinner, stir 10 MIN

 

 

Hold time

 

More than 20 minutes, but not more than 24 hours

 

 

Coating

 

Screen printing by 36-43T polyester screen. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: 45- 60%RH. Printing wet film thickness requirements in more than 38-45 um, and above 25-30 um after drying.

 

 

Hold time

 

More than 20 minutes after printing, But not more than 2 hours

 

 

Pre-cure

 

First side: by hot air dryer at 70-75℃ for 10-20min

Back side: by hot air dryer at 70-75℃ for 25-30min

Both side: by hot air dryer at 70-75℃ for 35-55min

 

 

Cooling

 

Hold more than 20 minutes  to cool down enough,  But not more than 24 hours

 

 

Exposure

 

400-600mj/cm2 (on resist surface) to 10-12 level

 

 

 

Hold time

 

Hold 20 min after exposure,But not more than 24hours

 

 

Developing

 

By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 50-90sec

Rinsing by 1.5-2.0kg/cm2 spraying of water at below 25℃ for 60-100sec Taking off rinsing water by sponge roll and drying by hot air at 45℃ for several minutes

 

 

Post cure

 

ENIG、IMT :150℃×50 MIN;

OSP、HASL:150℃×60 MIN;

Heavy copper PCB(more than 2OZ):75℃×120MIN+100℃×30MIN+150℃×60MIN

Plug Hole PCB:65℃×60MIN+80℃×30MIN+100℃×30MIN+120℃×30+150℃×60MIN

 

 

Screen print Marking ink

 

Screen printing and curing condition depend upon marking specification

 

 

 

Coating properties涂膜特性(IPC-SM-840E)

要求Requirement

测试方法Test Method

结果Result

防霉性Nonnutrient

IPC-TM-650 2.6.1

OK

表面状况Visual Requirements

IPC-SM-840E   3.3.1

OK

铅笔硬度Pencil Hardness

ASTM D3363

OK

附着力(硬板)Adhesion of RPB

IPC-TM-650 2.4.28.1

OK

可加工性Mach inability

IPC-TM-650 2.4.7.1

OK

耐溶剂和清洗剂

Resistance to Solvents and Cleaning Agents

IPC-TM-650 2.3.42

涂膜无分离、裂纹、粘着

Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation

OK

耐化学试剂

Resistance to Assembly Processes and Chemistry

IPC-SM-840E 3.6.1.2

10vol% H2SO4   20℃    30min

10wt% NaOH    20℃    30min

OK

水解稳定性

Hydrolytic Stability

IPC-TM-650 2.6.11

OK

阻燃性Flammability

UL94 V0  E343546

OK

可焊性Solder ability

J-STD-003    260±5℃*10±1

OK

耐焊性

Resistance to Solder

 

IPC-TM-650 2.6.8

Flux shall be a ROM0 or ROM1 per J-STD-004

助焊剂应依据J-STD-004,使用ROM0或ROM1

浮锡 Solder Float 260±5℃*10±1

OK

Simulation of Lead Free Reflow

无铅回流焊模拟

IPC-SM-840E 3.7.3.1

浮锡Solder Float 260±5℃*10±1秒*5次

OK

介电强度Dielectric Strength

IPC-TM-650 2.5.6.1

1000 V DC/mil

绝缘电阻Insulation Resistance

IPC-TM-650 2.6.3.1

≧7.0×1012Ω

耐湿绝缘电阻Moisture and Insulation Resistance

IPC-TM-650 2.6.3.1

≧5.0×108Ω

电迁移Electrochemical Migration

IPC-TM-650 2.6.14

OK

冷热冲击Thermal Shock

IPC-TM-650 2.6.7.3

-65℃ to +125℃ *100 Cycles

-65℃ 到 +125℃ *100次

OK

 

备注:此资料为本公司试验结果,不作为保证之用。适宜之条件,需参照操作指引,待贵公司实施确认后,再予以确定。

PS: This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.

若英文内容与中文内容有差异,以中文为准。

In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail.

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