高精密印制电路板专用油墨生产商

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COANTS ELECTRONIC

PM-500 DI系列

新建文件夹-2-708b59dcb34f04a7f26f4749cc0c823

 

PM-500 FW01DI是挠性板专用双组份白色液态感光阻焊材料,采用丝网印刷适用于DI曝光工艺。耐热性好,耐化金性能好。低卤素,符合RoHS和REACH要求。且黄变性优良,反射率80%以上。

PM-500  FW01DI is a special two-component white liquid photosensitive anti-welding Solder Mask for FPC. It is screen printed and suitable for DI exposure process.Good heat resistance, good resistance to gold.Low halogen, meeting RoHS and REACH requirements.And yellow denaturation is good, reflectivity above 80%.

一、物性General properties

1

主剂Main agent

PM-500 FW01DI

2

固化剂Hardener

H-50 FWH2

3

颜色Color

白色 White

4

主剂粘度

Main agent’s Viscosity (at 25℃)

240-280P

5

固化剂粘度

Hardener’s Viscosity (at 25℃)

70-130P

6

混合比例Mixing ratio

主剂Main agent:固化剂

Hardener=8515

7

混合后粘度

Viscosity after mixed (at 25℃)

160±20dPa.s

8

混合后固体含量

Non-volatile % after mixed

78±3%

9

混合后比重

Specific gravity after mixed

1.2±0.05

10

黄变性color change (IR 270℃ Thickness 25um)

?E<1.5

11

反射率Reflectivity at 450nm

(Thickness 25um)

80-85%

12

保存期限Shelf life

6个月/ 6 month after production

13

包装规格Package

1Kg/Cans(罐),10Kg/Box(箱)

14

曝光能量Exposure energy

以21级曝光尺为准感度9-12格

The sensitivity is 9-12 grids according to the 21-level exposure rule

 

 

  • 应用操作指引

 

基板表面处理

 

中粗化或微蚀化学处理,市水冲洗干净

 

 

开油

 

主剂与固化剂按8515混合,添加适量稀释剂,搅拌或震荡5-10分钟。

 

 

静置

 

10-20分钟,使油墨充分排出开油时产生的气泡,但不超过24小时。

 

 

印刷

 

36T或者43T网印刷

清洁筛网避开其他油墨污染,室温20-25℃,湿度小于60%RH

印刷厚度要求湿膜在30-40um,干燥后20-25um。

 

 

静置

 

20分钟以上,板材铜箔越厚,静置时间应越长,但不超过4个小时。

 

 

预烤

 

两面分别印刷、分别烘烤

第一面热风循环烤箱:温度70-75℃,时间10-20分钟

第二面热风循环烤箱:温度70-75℃,时间15-30分钟

 

 

冷却叠板

 

放置20分钟以上使板材充分冷却,但停放时间不超过24小时。

叠板不易过多,叠板压力不超过40 mmHg

 

 

曝光

 

以21级曝光尺为准感度9-12格

 

 

静置

 

20分钟以上,但不超过24小时

 

 

显像

 

  压力2.0-2.5kg/cm2浓度1wt% Na2CO3,液温30±2℃,显像时间70-90秒

过显影缸后,再用2.5-3.0kg/cm2喷淋压力25℃左右的市水清洗45-60秒,使用2组以上海棉轮吸水,40℃以上热风吹干

 

 

热固化

 

普通板:150℃×60分钟

厚铜板(2OZ及以上):第一段75℃×120分钟、

第二段100℃×30分钟、第三段150℃×60分钟

 

 

丝印字符

 

丝网印刷设备及固化条件依字符油墨操作条件

 

 

 Processing instructions

Pre-treatment

 

Copper surface roughening treatment

Rinse with distilled water

 

 

Mixing

 

Main agent and hardener agent in 85:15mix, add appropriate thinner, stir or shock 5-10 minutes

 

 

Hold time

 

Hold time: within 20min after printing, But not more than 24 hours

 

 

Coating

 

Screen printing by 36-43T polyester screen. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: under 60%RH. Printing wet film thickness requirements in more than 30-40 um, and above 20-25 um after drying.

 

 

Hold time

 

Hold time: within 20min after printing, But not more than 4 hours

 

 

Pre-cure

 

First side: by hot air dryer at 70-75℃ for 10-20min

Back side: by hot air dryer at 70-75℃ for 15-30min

Both side: by hot air dryer at 70-75℃ for 15-40min

 

 

Laminate mask film

 

Hold 12-30min to cool down enough

Laminate mask film in vacuum under 40 mmHg

 

 

Exposure

 

The sensitivity is 9-12 grids according to the 21-level exposure rule

 

 

Hold time

 

Hold 20 min after exposure,But not more than 24hours

 

 

Developing

 

By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-90sec

Rinsing by 2.5-3.0kg/cm2 spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes

 

 

Post cure

 

Cure resist film thoroughly by hot air dryer at 150℃ for 60min

 

 

Screen print Marking ink

 

Screen printing and curing condition depend upon marking specification

 

 

  • 过程ATTENTION ON EACH PROCESS

 

  1. Operation environment should be clean room of 20-25deg.C and 50-60%RH under yellow lamp (UV cut) avoiding fluorescent and sunlight.

操作环境为20- 25dec, 50-60%RH的洁净室,在黄灯下(紫外线切断),避免日光灯和阳光照射。

  1. Open up the package when it becomes ambient temperature. Stir well before use.

常温下开罐使用,使用前应先搅拌均匀。

  1. Appropriate coating thickness on cupper circuits after thermal cure is 10um-20um. Thinner coating thickness may cause lower resistance in solder heat, chemical and Ni/Au plating. Thick coating may cause under cut and insufficient tackiness.

线路上涂层干膜厚度应在10 um-20um。薄涂层厚度可能会导致阻焊耐、化学镀镍/金性能下降。厚涂层可能导致侧蚀过大及附着力不足。

  1. Curing condition and window depend on oven type, batch size of work and curing condition of legend ink. Fink the optimum condition of your own

固化条件取决于烤箱类别,批量大小及油墨。客户应测试适合自己的最佳条件

  1. Exposure energy depends on material type of substrate or coating thickness. Find the optimum condition of your own based on resolution (undercut level), gross level, shoot-through, etc

曝光能量取决于基材类型和涂层厚度。找到自己的最佳条件,以达到最佳的分辨率。

  1. Control well the quality of developing agent in its density, temperature, spray pressure and dwelling time. Insufficient control may case deterioration in developing or under cut.

控制好显影液的浓度、温度、喷射压力和显影时间。控制不良可能导致显影不良侧蚀过大等。

  1. Set optimum curing condition and window with consideration of curing condition for legend ink. Shortage or excess cure may cause degrade of Coating properties.

设置最优的操作条件要注意油墨的固化条件。固化时间过长或不足都可能导致降低涂料的性能

  1. In case Ni/Au plating, set optimum curing condition and window with Consideration of curing condition for legend ink. Over curing cause lower Ni/Au plating resistance.

镀镍/金,设置最佳固化条件和显影条件。固化过度可导致抗镀镍/金性能下降。

 

四、特征CHARACTERISTICS

  (1) 显影宽容度DEVEL OPMENT TOLERANCE WINDOW:

Drying time

固化时间

72deg.C

40 min

72deg.C

50 min

72deg.C

60 min

72deg.C

70 min

Developability

显影能力

Clean

干净

Clean

干净

Clean

干净

Slight Residue

轻微不净

 

 (2)感度PHOTO SENSITIVITY :

Item

项目

Thickness

厚度

Energy

能量

Developing time

显影时间

Sensitivity

感度

Sensitivity

Kodak No.2

柯达2#感光尺

20±2um

60mj/cm2)

60 sec.

8step

80mj/cm2

9step

100mj/cm2

10step

 

所需能量:40 – 100 mJ/cm2 ORC直接成像机(Di-IMPACT DXE-3512)(使用355nm以下的滤波器,by ORC Direct Imaging Mechanics (Di-IMPACT DXE-3512) (use cut filter below 355nm)

 

 

 

  • PROPERTIES 涂膜物性

 

ITEM

项目

TEST METHOD

测试方法

RESULT

测试结果

Adhesion

附着力

Coants Internal Test Method

Cross hatch/Tape peeling

百格法/胶带剥离

100/100

Pencil hardness

铅笔硬度

Coants Internal Test Method

No scratch on copper surface

铜表面上没有划痕

4H

Solder heat resistance

耐热性

Rosin flux 260deg.C/10sec.1cycle

Solder bath floating test

浮锡测试260℃*10秒*1次

Pass

Solvent resistance

耐溶剂

PMA-AC, 20deg.C/20min.immersion

Cross hatch/Tape peeling

PGM-AC*20℃*20分钟

Pass

Acid resistance

耐酸性

10vol% HCl, H2SO4, 20deg.C/20min.immersion,

Cross hatch/Tape peeling

Pass

Alkaline resistance

耐碱性

10wt% Na OH, 20deg.C/20min.

Immersion, Cross hatch/Tape peeling

Pass

Insulation resistance

绝缘电阻

IPC comb type B pattern

25-65deg.C,90%RH

DC100V for 7 days

Measurement:DC500V/1min.

Value at room temperature

Initial初始值

2.8*10×1013Ohm

Conditioned终值

6.6×1012Ohm

Dielectric constant

介电强度

25-65deg.C,90%RH

DC100V for 7 days

Measured at 1MHz/room

temperature

Initial初始值  4.3

Conditioned终值 4.5

Dissipation factor

介电常数

25-65deg.C,90%RH

DC100V for 7days

Measured at 1MHz/room

temperature

Initial初始值  0.030

Conditioned

终值0.042

Electroless Au plating

耐化学金性

Coants lab. Method

Ni 3um/Au 0.03um

Pass

 

*All test data mentioned above in this technical data sheet are based on our laboratory test result and just for reference, not guarantee the same in your process.

以上所测数据是基于我们的实验室试验结果和参考,不能保证之用。

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